Background: Dental implants represent a reliable and predictable treatment option for edentulous patients but implant–abutment microgaps remain a potential site for bacterial infiltration and mechanical stress concentration. The integrity of the implant– abutment connection (IAC) is therefore essential to ensure longterm implant success and prevent biological and mechanical complications. Aim :This study aimed to evaluate the performance of a novel implant–abutment connection under different insertion torques using an in vitro approach, combining mechanical loading tests and micro-computed tomography (micro-CT) analysis to assess stress distribution, fracture resistance, and microgap formation. Materials and Methods: A comparative in vitro case-control study was conducted on OSSTEM® KS implants with two insertion torques (35 Ncm and 70 Ncm). Finite Element Method (FEM) simulations assessed stress distribution through Von Mises analysis .Mechanical loading was performed according to ISO 14801:2016 standards using MTS ACUMEN equipment, followed by micro-CT analysis to evaluate the microgap. The implants were tested under static and cycle conditions. Results: FEM simulations demonstrated uniform stress distribution with a maximum Von Mises stress of 892.58 MPa, indicating high mechanical compatibility of the KS implant design. No statistically significant differences were observed between 35 Ncm and 70 Ncm groups during cyclic and static loading. Conclusions: The novel KS implant–abutment connection showed favorable biomechanical and sealing performance. The KS system provides reliable mechanical and biological performance, supporting its clinical use in posterior restorations where occlusal loads are high. Further long-term clinical trials are warranted to validate these outcomes

Evaluation of a novel implant-abutment connection: Micro-CT Analysis of Microgap under loading cycle and in-vitro clinical evaluation

MELODIA, DARIO
2026

Abstract

Background: Dental implants represent a reliable and predictable treatment option for edentulous patients but implant–abutment microgaps remain a potential site for bacterial infiltration and mechanical stress concentration. The integrity of the implant– abutment connection (IAC) is therefore essential to ensure longterm implant success and prevent biological and mechanical complications. Aim :This study aimed to evaluate the performance of a novel implant–abutment connection under different insertion torques using an in vitro approach, combining mechanical loading tests and micro-computed tomography (micro-CT) analysis to assess stress distribution, fracture resistance, and microgap formation. Materials and Methods: A comparative in vitro case-control study was conducted on OSSTEM® KS implants with two insertion torques (35 Ncm and 70 Ncm). Finite Element Method (FEM) simulations assessed stress distribution through Von Mises analysis .Mechanical loading was performed according to ISO 14801:2016 standards using MTS ACUMEN equipment, followed by micro-CT analysis to evaluate the microgap. The implants were tested under static and cycle conditions. Results: FEM simulations demonstrated uniform stress distribution with a maximum Von Mises stress of 892.58 MPa, indicating high mechanical compatibility of the KS implant design. No statistically significant differences were observed between 35 Ncm and 70 Ncm groups during cyclic and static loading. Conclusions: The novel KS implant–abutment connection showed favorable biomechanical and sealing performance. The KS system provides reliable mechanical and biological performance, supporting its clinical use in posterior restorations where occlusal loads are high. Further long-term clinical trials are warranted to validate these outcomes
27-mar-2026
Italiano
Implant-abutment; Conical Connection; Micro-CT; Mecchanical; Fatigue Resistence
TALLARICO, Marco
Università degli studi di Sassari
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14242/363546
Il codice NBN di questa tesi è URN:NBN:IT:UNISS-363546